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SPEED has built a comprehensive "thermal management + cabling + structural components" solution, covering categories such as GPU/CPU water cooling heads, GPU/CPU air cooling modules, and optical module heat sinks. With high-power heat dissipation capabilities, it empowers efficient and reliable operation of high-density computing and AI applications
A precision cooling core component for high-power chips, utilizing an ultra-thin skiving process to form a large-area heat exchange matrix, significantly shortening the heat conduction path. It ensures long-term stable operation, meeting the 7×24-hour uninterrupted operation requirements of data centers
A core temperature control component for high-speed transmission, featuring a dense fin structure that closely attaches to the cold plate to efficiently reduce thermal resistance. It supports flexible switching between liquid cooling and air cooling solutions, adapting to the construction needs of high-density clusters
Equipped with temperature/humidity sensors and liquid sensors, featuring insulation and IP67 waterproof rating
DAC and AEC transmission harnesses for internal and external cabinet connections
25~120 mm², shielded and unshielded high-voltage cable harnesses
A high-performance, fully protected cable harness for data transmission, signal transmission, sensor signaling, and low-voltage power supply, featuring shielding, waterproofing, and high-temperature resistance
We look forward to working with you to create more value for the industry
