PCS Liquid Cooling Plate

(In Planning)

The core active liquid cooling component specifically designed for high-power, high-power-density Power Conversion Systems (PCS), addressing high heat generation challenges to ensure stable, efficient, and long-life system operation

PCS液冷板.png

PCS液冷板.png

Features

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Non-destructive testing for reliable structure

Utilizes water-immersion ultrasonic C-scan technology for 100% inspection of all welds

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Controlled flow channel cleaning for long-term stability

Implements rigorous multi-stage flow channel cleaning and particle contamination testing procedures

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Precise flow resistance control for optimized energy efficiency

Conducts full-range flow resistance testing from 1 to 30 LPM to ensure no blockages

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Specifications

Operating Pressure ≤ 1.0 MPa (standard), higher pressure ratings available upon request
Burst Pressure ≥ 3.0 MPa
Leak Rate ≤ 1×10⁻⁹ Pa·m³/s (Helium test)
Thermal Resistance < 0.05 °C/W (value depends on design and contact surfaces)
Surface Roughness Ra ≤ 1.6μm (ensures optimal contact)
氦检测试 --
氦检测试 --
喷涂厚度 --
涂层绝缘电阻 --
漏电流 --
电压 --
爆破实验爆破压力 --
零件压紧状态按整体平面度 --
模组区域平面度 --
散热效率 --
温差控制 --
流道压降 --
密封与可靠性 --
轻量化 --
Base Plate Material --
Copper Tube Material --
Skived Fin & Heat Pipe Bonding --
Heat Pipe Operating Temperature Range --
Epoxy Adhesive Operating Temperature Range --
Total Heat Sink Power --
Temperature Difference Between Two Heat Pipes in Same Module --
Rapid Temperature Cycling Reliability Test --
High Temperature Test --
Humidity Test --

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Product features
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