Compact & efficient
Custom ultra-thin heat pipes + high-density fins maximize space utilization
Mini PC Cooling Module
VC + Fin combination delivers maximum thermal performance in a minimal footprint
Features
01
Instant peak power handling
Ultra-low thermal resistance path and high-conductivity materials tackle transient power spikes with ease
02
Uniform temperature, stable performance
Rapid heat spreading across chip surface prevents hot spots for reliable operation
03
Menu
Product features
Searching for products? Try
Filters
Filters
Unlimited Possibilities, Starting from Here
We look forward to working with you to create more value for the industry