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It is a functional electrical component composed of a highly conductive copper busbar substrate combined with a specialized flame-retardant foam adhesive layer. It offers the dual advantages of reliable conductivity and efficient installation
Reliable Adhesion & Precise Positioning
The foam adhesive layer offers lasting tack with a peel strength ≥1.5N/mm, showing no significant degradation after 5 years at room temperature. It allows for quick and precise busbar fixation, preventing installation misalignment
01
Insulating Buffer & Safety Protection
The foam layer provides an insulation resistance >10¹³Ω and dielectric strength ≥20kV/mm. It also offers excellent cushioning, absorbing vibration and shock to reduce wear between the busbar and the mounting surface
02
Excellent Conductivity & Low Loss
The copper substrate is made of T2 pure copper with a conductivity ≥98% IACS. It features strong current-carrying capacity and low contact resistance at joints, minimizing power transmission loss
03
Flame Retardant, Durable & Long Life
The foam layer achieves a UL94 V0 flame retardancy rating and operates within -40°C to 120°C. It is resistant to moisture and aging, ensuring a service life of ≥10 years under normal operating conditions
04
| Material | Aluminum, Copper, Copper-Aluminum Composite |
| Damp Heat Test | 85°C / 85% RH |
| Thermal Shock Test | -40°C to 95°C / 30 min cycle |
| Storage Temperature Range | -40°C to 75°C |
| Corrosion Resistance (Plating) | 72h Neutral Salt Spray Test |
| Insulation Resistance | 100MΩ |
| Withstanding Voltage | 3400V DC |
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